Gaining comprehensive knowledge covering theory and practical advices about thru hole and surface mount components assembly as well as wires and cables.
Training time length
Number of hours: program dependent – modularity of training
Training program
Module I – theory
Introduction
Products classes and acceptability states according to IPC
Classification of printed circuit boards
General requirements related to safety, equipment, materials, electostatic discharges
General requirements related to solder connections
General requirements related to thru hole and surface mounted components, wires and cables
Process requirements related to cleaning of electronic packets
Requirements for coating layers
Assurance of production quality: testing methods, using statistic control process
Examination
Module II – theoretically-practical classes
Soldering of wires to different types of terminals
Module III – theoretically-practical classes
Mounting of components made in thru hole technology
Module IV – theoretically-practical classes
Mounting of components made in surface mount technology
Module IV – theoretically classes
Methodology of inspection: requirements for thru hole and surface mount components assembly as well as wires and cables
Training destined for persons
Directly involved in mounting or control of printed circuit s boards made in PTH and SMT technology
Directly involved in mounting or control of connections made by using wires and cables
Advantages for participants
Knowledge about mounting criteria of printed circuits made in surface mount and thru hole technology as well as wires and cables in accordance with international standards
Getting textbooks with didactic materials
Will receive personal, international certificate of finishing IPC-J-STD-001 Certified IPC Specialist.
