Gaining comprehensive knowledge covering theory and practical directions about modification and repairs techniques of electronic devices and printed circuits according to IPC-7711 and IPC-7721 standards
Training time length
Number of hours: program dependent
Training program
Chapter I – Introduction: generally used procedures.
Chapter II – Wires connections by braiding.
Chapter III – Dismount/mount of thru hole components.
Chapter IV – Dismount/mount of Chip and Melf components.
Chapter V – Dismount/mount of SOT and SOIC components.
Chapter VI – Dismount/mount of J-Lead and QFP components.
Chapter VII – Repair of printed circuits boards: repair of solder lands, eyelets and holes metallisation, printed circuits, shorts mounting.
Chapter VII – Laminate repairs.
Chapter IX – Coating: identification, removal, repairs.
Chapter I is obligatory, the rest depending on customers requirements.
Training destined for persons
Directly involved in repairs of electronic devices maid in SMT and PHT technology
Advantages for participants
Gaining the newest knowledge about obligatory international standards if comes to repairs and modification of electronic devices and printed circuit boards made in surface mount and thru hole technology
Getting textbooks with didactic materials
Receiving personal, international certificate of finishing IPC-7711/7721 Certified IPC Specialist training.
